PacTech-Packaging Technologies GmbH

Founded as a spin-off of the federal scientific Fraunhofer IZM in 1995, the company consists of two business units:

1. Manufacturer of advanced wafer level packaging and wafer bumping production equipment.

2. Provider of high-quality, subcontract manufacturing services.

With subsidiaries in California and Malaysia, the corporation supplies its outstanding solutions in these relevant business regions.

PacTech, a group member of Nagase & Co., Ltd., is a leading provider of subcontractor services for wafer level packaging and a manufacturer of equipment for advanced packaging.

Since almost 20 years PacTech offers wafer bumping services for high volume production or low volume quick turn out of Nauen, Germany (HQ), Santa Clara, CA, USA and Penang, Malaysia. All three manufacturing facilities have a wafer bumping capacity of 600,000 wafers each per year and are capable of handling wafers up to 300mm. At present the company has about 300 employees.

The business unit “Advanced Packaging Equipment” is manufacturing equipment for the electronics, medical, automotive and consumer industry. The equipment product line consists of automatic wet chemical lines for high volume electroless NiAu & NiPdAu bumping (PacLine 300 A50), solder jetting equipment (SB2-Jet), wafer-level solder ball transfer systems (Ultra-SB2 300), wafer-level solder rework equipment (Ultra-SB2 300 WLR), and laser assisted flip-chip bonders (Laplace). Those unique and highly innovative manufacturing systems are providing solutions for today’s tasks and challenges in advanced packaging applications.

Role & Key Contribution:

Process development for high temperature packaging technologies such as nickel/silver UBMs, laser sintering and solder materials with high melting points

Contact

PacTech-Packaging Technologies GmbH

Am Schlangenhorst 15-17
14641 Nauen, Germany
www.pactech.de