Besi Netherlands B.V., based in Duiven, the Netherlands, produces molding, trim & form and singulation systems for both leadframe and advanced packaging applications. All equipment, tools, molds and mold kits are produced in Besi's Shah Alam, Malaysia and/or Leshan, China facilities.

BE Semiconductor Industries N.V. (Besi) develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, computer, automotive, industrial, LED and solar energy.

Role:

The role of Besi within this project is to apply its know-how on packaging to investigate the feasibility of product concepts and to develop and apply new packaging technology for test samples. Resulting in a process, possibly a pilot line, to produce demonstrators.

Key Contribution:

• Development and application of molding technologies for power device packaging including GaN and wafer level molding of 3D stacked systems.
• Technology development for wafer level of molding of lenses for optical sensors, to allow further miniaturize of 3D systems.
• Development of tools and processes for collective sintered interconnects for power devices.

Contact

	Besi Netherlands B.V.
Ratio 6
6921 RW, Duiven, The Netherlands
www.besi.com